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Code · CFR · Title 15 — Commerce and Foreign Trade · Part 231 — Clawbacks of Chips Funding · § 231.108

§ 231.108. Material expansion.

69 words·~1 min read·/us/cfr/t15/s§ 231.108·

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Material expansion means:
(1)with respect to an existing facility, the increase of the semiconductor manufacturing capacity of that facility by more than five percent of the capacity memorialized in the required agreement due to the addition of a cleanroom, production line or other physical space, or a series of such additions; or
(2)any construction of a new facility for semiconductor manufacturing. \[88 FR 89574, Dec. 28, 2023\]
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§ 231.108
Material expansion.
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